Packaging development engineer
Nxp· Kuala Lumpur
seen live 1 day ago
The Senior Flip-Chip Front-End Packaging Development Engineer – Die Attach & Underfill is responsible for leading FC-FE process development, optimization, and integration activities for die attach and underfill process. This role requires strong technical capability in process
This link goes straight to the employer's workday page. Posted 5 days ago.We last confirmed it was open 1 day ago.