Packaging Engineer- Flip Chip

Volantis Semiconductor, Inc.· Hybrid Remote/SF Bay Area/Austin/Boston

hybrid seen live 1 day ago

We're seeking experienced engineers to contribute to flip chip package development and assembly processes for advanced semiconductor devices (2.5D/3D/chiplet/fan-out/flip-chip). This spans bump metallurgy, substrate integration, reflow and underfill processes, reliability,

Apply on Volantis Semiconductor, Inc.'s site

This link goes straight to the employer's greenhouse page. Posted 73 days ago.We last confirmed it was open 1 day ago.