Packaging Engineer- Bump Interconnect

Volantis Semiconductor, Inc.· Hybrid Remote/SF Bay Area/Austin/Boston

hybrid seen live 1 day ago

We’re seeking an experienced engineer to lead bump interconnect development for advanced semiconductor devices (2.5D/3D/chiplet/fan-out). This role spans ubump and C4 bump metallurgy, RDL design and plating, chip-side and interposer capture pad design rules, OSAT engagement,

Apply on Volantis Semiconductor, Inc.'s site

This link goes straight to the employer's greenhouse page. Posted 74 days ago.We last confirmed it was open 1 day ago.