Packaging Engineer- Materials

Volantis Semiconductor, Inc.· Hybrid Remote/SF Bay Area/Austin/Boston

hybrid seen live 1 day ago

We’re looking for a hands-on process and materials engineer to own wafer level molding and underfill processes, material qualification, and assembly integration across development and manufacturing. Summary: Seeking an experienced engineer to lead wafer level mold and underfill

Apply on Volantis Semiconductor, Inc.'s site

This link goes straight to the employer's greenhouse page. Posted 72 days ago.We last confirmed it was open 1 day ago.